Bluetooth Modules

Download Selection Guide

Accelerate your Time to Market with Bluetooth module solutions

Implementing a Bluetooth solution for your product has never been this easy. Whether you are looking for Bluetooth Classic or Bluetooth Smart, in need of a SoC solution or a module to connect to an existing processor, LSR offers a Bluetooth SIG certified module to meet your needs.

The all new SaBLE-x™ Bluetooth Smart SoC module, with industry-leading RF and power performance when compared to the legacy TiWi-uB1 module, provides the range, size, and battery life you need for low-energy applications like remote sensor. The TiWi-uB2 is Bluetooth Smart Ready, providing you flexibility to utilize either the Bluetooth Classic or Smart protocol, while integrating with the existing processor in your product design.

TiWi-BLE, along with its dual-band counterpart TiWi5, have set the standard for pre-certified Bluetooth + Wi-Fi module performance. Optimized to work with an external microprocessor, the TiWi-BLE module provides the fastest path to adding 2.4 GHz wireless capability to your product. For specialized applications or settings, the TiWi5 provides the additional capability of communicating in the 5 GHz band. Explore how our Bluetooth modules can make your wireless product better.

Modules Selection Guide Bluetooth Videos Designing with Bluetooth Smart

SaBLE-x

2.4 GHz Bluetooth Low Energy (BLE) Module

SaBLE-x BLE Module with SOC side

Datasheet

Product Brief

  • Size: 11.6 mm x 17.9 mm x 2.3 mm
  • On-Module Integration: Integrated ARM Cortex-M3 MCU, dedicated Cortex-M0 MCU for RF core, and dedicated Sensor Processor Engine
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, ETSI, Giteki, RCM, SIG
  • Continue reading about the SaBLE-x Bluetooth Low Energy (BLE) Module

TiWi-uB1

Bluetooth Smart Module with System-on-Chip (SoC)

TiWi-uB1 Bluetooth Smart Module with SOC front

Datasheet

Product Brief

  • Size: 11.6 mm x 17.9 mm x 2.3 mm
  • Host Processor Requirements: Integrated 8051 microcontroller or network processor interface for applications running on an external microcontroller
  • Hardware Interfaces: UART, SPI, Digital I/O, and Analog Inputs
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, ETSI, Giteki, SIG
  • Continue reading about the TiWi-uB1 Bluetooth Smart Module SoC

TiWi-uB2

Bluetooth Smart Ready Module

TiWi-uB2 Bluetooth Smart Ready Module front

Datasheet

Product Brief

  • Size: 7 mm x 7 mm x 1.5 mm
  • Host Processor Requirements:: Microcontroller or microprocessor with a serial port (UART)
  • Hardware Interfaces: HCI, UART, and Audio PCM interfaces. Compact design based on TI CC2564 Transceiver
  • Industrial Temp Range: -30 to +85 °C
  • Certifications: FCC, IC, Giteki, SIG, CE
  • Continue reading about the TiWi-uB2 Bluetooth Smart Ready Module
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Johanson 2.4 GHz Chip Antenna #2450AT43B100

BT900

Intelligent BTv4.0 Dual Mode Module featuring smart BASIC

Bluetooth 4.0 Dual Mode Module
  • Size: 19 mm x 12.5 mm x 2.5 mm
  • Bluetooth Version: 4.0 Dual Mode
  • Hardware Interfaces: UART, I2C, SPI, ADC, GPIO
  • Software: Laird's powerful, event-driven smartBASIC language for rapid design and deployment
  • Profiles: Supports SPP and any BLE Peripheral or Central roles
  • Host Processor Requirements: Hostless operation — No need for external MCU reducing overall BOM
  • Certifications: FCC, IC, ETSI, SIG
  • Continue reading about the BT900 on Lairdtech.com

BL600 Series

Single-Mode BLE Module Featuring smartBASIC

Single-Mode BLE Module Featuring smartBASIC
  • Size: 19 mm x 12.5 mm x 3 mm
  • Bluetooth Version: 4.0 Single Mode
  • Hardware Interfaces: UART, SPI, I2C, ADC, and GPIO interfaces for connecting peripherals and sensors
  • Software: Laird's powerful, event-driven smartBASIC language for rapid design and deployment
  • Profiles: GATT-based BLE profiles that include Blood Pressure, Heart Rate, Health Thermometer, Proximity and Find Me
  • Software Stack: A complete BLE software stack
  • Certifications: FCC, IC, CE
  • Continue reading about the BL600 Series on Lairdtech.com

BL620

Central Mode BLE Module Featuring smartBASIC

Central Mode BLE Module Featuring smartBASIC
  • Size: 19 mm x 12.5 mm x 3 mm
  • Bluetooth Version: 4.0 Single Mode
  • Hardware Interfaces: UART, SPI, I2C, ADC, and GPIO interfaces for connecting peripherals and sensors
  • Software: Laird's powerful, event-driven smartBASIC language for rapid design and deployment
  • Profiles: Central role functionality with GATT client and server - Ability to connect up to four simultaneous connections
  • Software Stack: A complete BLE software stack
  • Certifications: FCC, IC, CE
  • Continue reading about the BL620 on Lairdtech.com

BL652

Bluetooth V4.2 + NFC

BL652 Bluetooth Module with NFC
  • Size: 14 mm x 10 mm x 2.1 mm
  • Bluetooth Specification: v4.2 - Single Mode (Peripheral and Central Roles)
  • Hardware Interfaces: UART, GPIO, SPI, ADC, PWM and FREQ, NFC
  • Industrial Temp Range: -40°C to +85°C
  • Certifications: FCC, IC, ETSI, SIG, MIC
  • Continue reading about the BL652 on Lairdtech.com

Bluetooth + Wi-Fi Modules

Sterling-LWB

2.4 GHz Wi-Fi and Bluetooth Smart Ready Multi-Standard Module

Sterling-LWB WiFi + Bluetooth Smart Ready Module Base Left

Datasheet

Product Brief

  • Size: 10 mm x 10 mm x 1.2 mm (SIP)
  • Size: 15.5 mm x 21 mm x 2 mm (Chip)
    Size: 15.5 mm x 21 mm x 2 mm (U.FL)
  • Hardware Interfaces: Dev Board with SD card form factor for simple connectivity with Freescale i.MX 6 and other platforms
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, ETSI, Giteki, RCM
  • Continue reading about the Sterling-LWB Wi-Fi + Bluetooth Low Energy (BLE) Module

TiWi-BLE

Bluetooth Classic & Bluetooth Low Energy + Wi-Fi 802.11 b/g/n Module

TiWi-BLE Smart Ready Wi-Fi plus Bluetooth Module left

Datasheet

  • Size: 18 mm x 13 mm x 1.9 mm
  • Host Interface: SDIO
  • Host Processor Requirements: Microprocessor to run WLAN TCP/IP stack
  • Industrial Temp Range: -40 to +85 °C
  • Hardware Interfaces: SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®)
  • Certifications: IC, ETSI, Giteki, FCC Bluetooth Grant, FCC WLAN Grant, SAR Testing, SAR Testing EU
  • Continue reading about the TiWi-BLE Bluetooth + Wi-Fi Module
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2.4 GHz Ethertronics Antenna, Presetta 1000423
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Johanson 2.4 GHz Chip Antenna #2450AT43B100

TiWi5

Bluetooth & Bluetooth Low Energy with Integrated Dual-Mode Wi-Fi 802.11 a/b/g/n Module

TiWi5 Wi-Fi plus Bluetooth Low Energy Dual Band Module front

Datasheet

Product Brief

  • Size: 18 mm x 13 mm x 1.9 mm
  • Host Processor Requirements: Microprocessor to run WLAN TCP/IP stack
  • Hardware Interfaces: SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®)
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, CE
  • Continue reading about the TiWi5 Bluetooth + Wi-Fi WLAN 802.11 a/b/g/n Module
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2.4/5.4 GHz Ceramic Dual B and Chip Antenna 2450AD46A5400E

45 Series

Complete Enterprise 802.11a/b/g/n Wi-Fi and Bluetooth v4.0 dual-mode solution

45 Series 802.11abgn and 802.11abgn + Bluetooth
  • Technology: The Wi-Fi module uses Qualcomm Atheros AR6003 - supports IEEE 802.11a/b/g/n and the Bluetooth module uses the CSR8510 Bluetooth chip
  • Bluetooth Interface: CSR CSR8510 Bluetooth 4.0 dual-mode (EDR+BLE)
  • Chip Set: Atmel 400 MHz ARM 9, P/N AT91SAM9G25-CU
  • Certifications: FCC, IC, CE
  • Continue reading about the 45 Series on Lairdtech.com

50 Series

Dual-Band 802.11n + BT4.0

50 Series Dual-Band 802.11n + BT4.0
  • Technology: 802.11r + CCKM support for rapid roaming and true TX/RX Diversity with 2x2 MIMO
  • Bluetooth Version: Bluetooth v2.1 with EDR, Bluetooth 4.0 (Bluetooth Low Energy)
  • Chip Set: Wi-Fi: Qualcomm Atheros QCA6004. Bluetooth: Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08
  • Certifications: FCC, IC, ETSI, Giteki, RCM
  • Continue reading about the 50 Series on Lairdtech.com

Bluetooth Module Selection Guide

 

Bluetooth® Low Energy Module

Bluetooth® Smart Module with System-on-Chip (SoC)

Bluetooth Smart Ready Module

 

SaBLE-x

TiWi-uB1

TiWi-uB2

Description

Built in CC2640 single-chip BLE 4.1 with ARM Cortex-M3 processor

Built in CC2541 single-chip BLE 4.0 System-on-Chip (SoC)

Bluetooth 2.1+ EDR, and BLE 4.0 module

Frequency Band

2.4 GHz

2.4 GHz

2.4 GHz

Host Processor Requirements

Integrated Cortex-M3 can act as microcontroller or network processor interface for applications running on an external microcontroller

Integrated 8051 microcontroller or network processor interface for applications running on an external microcontroller

Microcontroller or microprocessor with a serial port (UART)

Hardware Interfaces

UART, SPI, I2C, Digital I/O, and Analog Inputs

UART, SPI, Digital I/O, and Analog Inputs

HCI, UART, and Audio PCM interfaces

Size (mm)

11.6 mm x 17.9 mm x 2.3 mm

11.6 mm x 17.9 mm x 2.3 mm

7 mm x 7 mm x 1.5 mm

Antenna

  • PCB trace antenna
  • Dipole via U.FL
  • FlexPIFA™ via U.FL
  • FlexNotch™ via U.FL
  • Hybrid trace antenna
  • Dipole via U.FL
  • Off-module chip
  • Dipole via U.FL

Certifications

FCC Certification ICC Certification CE Certification Bluetooth SIG Certification

Wi-Fi + Bluetooth Module Selection Guide

 

Sterling-LWB™ 2.4 GHz Wi-Fi® and Bluetooth® Smart Ready Multi-Standard Module

Bluetooth-modules-with-WiFi-TiWi-BLE

WiFi-module-with Bluetooth-TiWi5

 

Sterling-LWB™

TiWi™-BLE

TiWi5™

Description

2.4 GHz Wi-Fi with Bluetooth 2.1+ EDR, BLE 4.1

Wi-Fi with Bluetooth 2.1+ EDR, BLE 4.0 and ANT+

Wi-Fi with Bluetooth 2.1+ EDR, BLE 4.0 and ANT+

Frequency Band

2.4 GHz

2.4 GHz

2.4 and 5.8 GHz

Host Processor Requirements

Microprocessor to run WLAN TCP/IP stack

Microprocessor to run WLAN TCP/IP stack

Microprocessor to run WLAN TCP/IP stack

Hardware Interfaces

SDIO (WLAN) and UART (Bluetooth®)

SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®)

SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®)

Size (mm)

10 mm x 10 mm x 1.2 mm (SIP)
15.5 mm x 21 mm x 2 mm (Chip antenna or U.FL)

13 mm x 18 mm x 1.9 mm

13 mm x 18 mm x 1.9 mm

Antenna

  • Chip Antenna
  • Dipole via U.FL
  • FlexPIFA via U.FL
  • FlexNotch via U. FL
  • Off-module chip
  • Dipole via U.FL
  • PIFA via U.FL
  • Flexible Dipole via U. FL
  • Off-module SMT antenna
  • Dipole via U.FL

Certifications

FCC Certification ICC Certification CE CertificationGiteki CertificationRCMCertificationBluetooth SIG Certification(All pending.)

FCC Certification ICC Certification CE Certification

Episode 1: BLE Technology Overview

Transcript

Episode 2: Mobile App Development and BLE

Transcript

Episode 3: FCC Certification and BLE

Transcript

5 Things You Need to Know about Designing with Bluetooth Smart

Since Bluetooth® version 4.0 was introduced by the Bluetooth Special Interest Group (SIG) in 2011, Bluetooth Smart (also commonly referred to as Bluetooth Low Energy or BLE) has become an increasingly popular option for wireless communication for small-data applications that require low power consumption. As a product developer looking to integrate Bluetooth Smart technology into your product development roadmap, here are five things you need to know:

  1. There are distinct differences between Bluetooth and Bluetooth Smart

    Bluetooth classic" and "Bluetooth Low Energy" are terms for two similarly-named Bluetooth technologies that offer different profile support intended for a range of product functions. Applications such as audio streaming require high data rates and transmission size, and typically use Bluetooth classic (BTC). These capabilities result in BTC requiring comparatively more power than does Bluetooth Low Energy (BLE). BLE is typically used for applications needing intermittent transmission of small amounts of data, such as simple data links to Smartphone apps and data tags. This lower power requirement allows BLE-based applications to utilize small, long-lasting batteries.

    Differences between Bluetooth and Bluetooth Smart to help you decide which Bluetooth module you need for your project

  2. Bluetooth SIG has introduced membership requirements for product manufacturers

    As of February 2014, it is necessary to become a member of the Bluetooth SIG to release an official Bluetooth product. Note that the Bluetooth SIG requires the owner of the product to be the member and the fee amounts are based on the size of that company's business in terms of annual revenue. See Bluetooth's qualification and listing process for more information.

  3. Products utilizing Bluetooth Smart technology are also subject to a Listing Fee

    The fee structure (outlined in the figure below), details how the Listing Fee is based on the type of Bluetooth SIG membership (Adopter vs. Associate) and eligibility for the Innovation Incentive Program (based on company annual revenue). In summary, unless the customer qualifies for their Innovation Incentive Program, the minimum Listing Fee is $4,000. To qualify for this low listing fee, Associate membership is required, which has an annual membership fee of $7,500 for companies having annual revenue under $100 million. The membership fee is $35,000 if annual revenue exceeds this. For an Adopter member there is no membership fee, but the listing fee is $8,000.

    Bluetooth Fee Structure as of October 2014

      Adopter Associate
    Membership Fee (annual) No Fee Based on company annual revenue
    $7,500 (under $100MM in revenue)
    $35,000 (over $100MM in revenue)
    Listing Fee Options Normal Listing Fees $8,000 $4,000
    Innovation Incentive Program (company revenue under $1MM) $2,500
  4. Branding requirements have also been established by the Bluetooth SIG

    To support the integrity of the brand and customer confidence in Bluetooth branded products, the Bluetooth SIG intends that the Bluetooth brand and trademark be used to identify products that properly interoperate. To that end, the SIG has clearly outlined its policies. In summary, if a company wishes to use the Bluetooth logo and branding trademarks, it must conform to the membership, product registration and performance policies established by the SIG. The underlying technology supporting Bluetooth is not claimed by the Bluetooth SIG as protected, however, any use of the Bluetooth name is. As a practical matter, to present a product to the market as supporting Bluetooth-enabled features the owner must become a member of the Bluetooth SIG. The SIG has established a program for brand enforcement.

  5. The use of a certified wireless module can simplify not only the FCC/IC/CE certification requirements for your product, but the Bluetooth SIG Qualification and Listing processes as well

    While the Bluetooth SIG now requires the product manufacturer to be official members and pay the appropriate Listing Fee, there is still a significant benefit in using a Bluetooth-compliant module in the design. Using such a module that is already registered as a "Qualified Design" with the Bluetooth SIG allows you to inherit the qualification testing already completed. This means you may potentially forego Qualification Project testing and documentation by using a Qualified Design, saving significant time and costs in design, testing, and documentation.

    Bluetooth qualification and listing process for taking a product to market

    As shown in the figure above (courtesy of www.bluetooth.org), the Listing process starts with defining and testing a product. If a product contains a Bluetooth module or components that are already listed, testing of the elements already tested in those are waived. For example, LSR's TiWi-uB1 and TiWi-uB2 are tested and recognized by the Bluetooth SIG as a conforming Controller Subsystems as specified in the Bluetooth SIG registration, so no end-product testing is required for a QDID to be issued by the Bluetooth SIG.

    Only the Bluetooth functionality added to the product using these modules must be tested. This is determined during the Declaration of Features and Test Plan Generation activities illustrated above. If it is necessary, testing may be done by a commercial third-party, such as an accredited EMC laboratory. LSR's on-site EMC Testing and Certification services are an outstanding resource to completing such testing.

    Bluetooth Smart, or BLE, continues to surge in popularity as a low-power wireless solution for M2M and IoT applications alike. These 5 important pieces of information will help you navigate the path of integrating BLE into your product. Talking with an LSR representative to learn more about the benefits of a certified Bluetooth module for your product is a great first step!

Information described herein is furnished for informational use only, is subject to change without notice, and should not be construed as a guarantee, commitment, condition or offer by LS Research, LLC. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by LS Research, LLC is under license. Other trademarks and trade names are those of their respective owners.