Embedded Wireless Modules

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SIMPLIFYING WIRELESS
Embedded wireless modules from LSR simplify the work to add wireless to your product design, providing a straightforward means for integrating wireless technologies such as Wi-Fi, Bluetooth, and Bluetooth Smart into new or existing product designs.

THE CONFIDENCE OF PRE-CERTIFICATION
LSR’s unique, comprehensive approach to pre-certification minimizes your design risk while insuring significant certification time and cost savings (Typically $30-50K). LSR takes pre-certification one step further by:

  • Including multiple antenna options in each module pre-certification, providing you more design flexibility while retaining the time and cost savings of pre-certification.
  • Offering the full capabilities and expertise to design custom antenna solutions for unique product applications.

UNMATCHED LEVELS OF SUPPORT
LSR’s US-based technical team is committed to a great customer experience, providing best-in-industry tech support.

  • LSR engineers also offer full Design Review services as you implement wireless modules into your design.
  • Each module is engineered to meet the long lifecycle needs of industrial, defense, and medical applications.
  • LSR’s commitment to support lasts throughout the life of the product, offering straight-forward solutions when it is time to update your design with newer technology performance.

NEW! FREE 3D Antenna Scans for any LSR Module Customer

Looking to implement an off-module antenna with any of LSR’s certified modules? We will help ensure your design will meet your performance specifications by offering a complimentary 3D Antenna Scan in our on-site 3D Antenna Test Chamber. LSR’s EMC test experts will follow up with a detailed report and address all your questions.

Modules Antennas Accessories

Bluetooth Modules

SaBLE-x

2.4 GHz Bluetooth Low Energy (BLE) Module

SaBLE-x BLE Module with SOC side

Datasheet

Product Brief

  • Size: 11.6 mm x 17.9 mm x 2.3 mm
  • On-Module Integration: Integrated ARM Cortex-M3 MCU, dedicated Cortex-M0 MCU for RF core, and dedicated Sensor Processor Engine
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, ETSI, Giteki, RCM, SIG
  • Continue reading about the SaBLE-x Bluetooth Low Energy (BLE) Module

TiWi-uB1

Bluetooth Smart Module with System-on-Chip (SoC)

TiWi-uB1 Bluetooth Smart Module with SOC front

Datasheet

Product Brief

  • Size: 11.6 mm x 17.9 mm x 2.3 mm
  • Host Processor Requirements: Integrated 8051 microcontroller or network processor interface for applications running on an external microcontroller
  • Hardware Interfaces: UART, SPI, Digital I/O, and Analog Inputs
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, ETSI, Giteki, SIG
  • Continue reading about the TiWi-uB1 Bluetooth Smart Module SoC

TiWi-uB2

Bluetooth Smart Ready Module

TiWi-uB2 Bluetooth Smart Ready Module front

Datasheet

Product Brief

  • Size: 7 mm x 7 mm x 1.5 mm
  • Host Processor Requirements:: Microcontroller or microprocessor with a serial port (UART)
  • Hardware Interfaces: HCI, UART, and Audio PCM interfaces. Compact design based on TI CC2564 Transceiver
  • Industrial Temp Range: -30 to +85 °C
  • Certifications: FCC, IC, Giteki, SIG, CE
  • Continue reading about the TiWi-uB2 Bluetooth Smart Ready Module
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Johanson 2.4 GHz Chip Antenna #2450AT43B100

BT900

Intelligent BTv4.0 Dual Mode Module featuring smart BASIC

Bluetooth 4.0 Dual Mode Module
  • Size: 19 mm x 12.5 mm x 2.5 mm
  • Bluetooth Version: 4.0 Dual Mode
  • Hardware Interfaces: UART, I2C, SPI, ADC, GPIO
  • Software: Laird's powerful, event-driven smartBASIC language for rapid design and deployment
  • Profiles: Supports SPP and any BLE Peripheral or Central roles
  • Host Processor Requirements: Hostless operation — No need for external MCU reducing overall BOM
  • Certifications: FCC, IC, ETSI, SIG
  • Continue reading about the BT900 on Lairdtech.com

BL600 Series

Single-Mode BLE Module Featuring smartBASIC

Single-Mode BLE Module Featuring smartBASIC
  • Size: 19 mm x 12.5 mm x 3 mm
  • Bluetooth Version: 4.0 Single Mode
  • Hardware Interfaces: UART, SPI, I2C, ADC, and GPIO interfaces for connecting peripherals and sensors
  • Software: Laird's powerful, event-driven smartBASIC language for rapid design and deployment
  • Profiles: GATT-based BLE profiles that include Blood Pressure, Heart Rate, Health Thermometer, Proximity and Find Me
  • Software Stack: A complete BLE software stack
  • Certifications: FCC, IC, CE
  • Continue reading about the BL600 Series on Lairdtech.com

BL620

Central Mode BLE Module Featuring smartBASIC

Central Mode BLE Module Featuring smartBASIC
  • Size: 19 mm x 12.5 mm x 3 mm
  • Bluetooth Version: 4.0 Single Mode
  • Hardware Interfaces: UART, SPI, I2C, ADC, and GPIO interfaces for connecting peripherals and sensors
  • Software: Laird's powerful, event-driven smartBASIC language for rapid design and deployment
  • Profiles: Central role functionality with GATT client and server - Ability to connect up to four simultaneous connections
  • Software Stack: A complete BLE software stack
  • Certifications: FCC, IC, CE
  • Continue reading about the BL620 on Lairdtech.com

BL652

Bluetooth V4.2 + NFC

BL652 Bluetooth Module with NFC
  • Size: 14 mm x 10 mm x 2.1 mm
  • Bluetooth Specification: v4.2 - Single Mode (Peripheral and Central Roles)
  • Hardware Interfaces: UART, GPIO, SPI, ADC, PWM and FREQ, NFC
  • Industrial Temp Range: -40°C to +85°C
  • Certifications: FCC, IC, ETSI, SIG, MIC
  • Continue reading about the BL652 on Lairdtech.com

Wi-Fi Modules

TiWi-C-W

Integrated 802.11 b/g/n WLAN Module

TiWi-C-W Wifi Module for Cloud Connectivity front

Datasheet

Product Brief

  • Size: 10.5 mm x 10.5 mm x 1.35 mm
  • Host Interface: UART
  • Development Architecture: Integration directly into M3 processor, or simple integration over UART interface to external microcontrollers or microprocessors
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, CE
  • Continue reading about the TiWi-C-W Wi-Fi Module: 802.11 b/g/n WLAN Module

TiWi-SL

Self-contained 802.11 b/g WLAN module

TiWi-SL 802.11 b/g Wifi Module front

Datasheet

Product Brief

  • Size: 14 mm x 21 mm x 2.3 mm
  • Host Processor Requirements: Microcontroller or microprocessor with a serial port (SPI) + 6 KB Flash, 3KB RAM, utilizing TI’s CC3000 SimpleLink™ technology to provide Wi-Fi functionality directly on the module
  • Host Interface: SPI
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, CE
  • Continue reading about the TiWi-SL Industrial Wi-Fi Module
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Johanson 2.4 GHz Chip Antenna #2450AT43B100

Wi-Fi + Bluetooth Modules

Sterling-LWB

2.4 GHz Wi-Fi and Bluetooth Smart Ready Multi-Standard Module

Sterling-LWB WiFi + Bluetooth Smart Ready Module Base Left

Datasheet

Product Brief

  • Size: 10 mm x 10 mm x 1.2 mm (SIP)
  • Size: 15.5 mm x 21 mm x 2 mm (Chip)
    Size: 15.5 mm x 21 mm x 2 mm (U.FL)
  • Hardware Interfaces: Dev Board with SD card form factor for simple connectivity with Freescale i.MX 6 and other platforms
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, ETSI, Giteki, RCM
  • Continue reading about the Sterling-LWB Wi-Fi + Bluetooth Low Energy (BLE) Module

TiWi-BLE

Bluetooth Classic & Bluetooth Low Energy + Wi-Fi 802.11 b/g/n Module

TiWi-BLE Smart Ready Wi-Fi plus Bluetooth Module front

Datasheet

  • Size: 18 mm x 13 mm x 1.9 mm
  • Host Interface: SDIO
  • Host Processor Requirements: Microprocessor to run WLAN TCP/IP stack
  • Industrial Temp Range: -40 to +85 °C
  • Hardware Interfaces: SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®)
  • Certifications: IC, ETSI, Giteki, FCC Bluetooth Grant, FCC WLAN Grant, SAR Testing, SAR Testing EU
  • Continue reading about the TiWi-BLE Bluetooth + Wi-Fi Module
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2.4 GHz Ethertronics Antenna, Presetta 1000423
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Johanson 2.4 GHz Chip Antenna #2450AT43B100

TiWi5

Bluetooth & Bluetooth Low Energy with Integrated Dual-Mode Wi-Fi 802.11 a/b/g/n Module

TiWi5 Wi-Fi plus Bluetooth Low Energy Dual Band Module front

Datasheet

Product Brief

  • Size: 18 mm x 13 mm x 1.9 mm
  • Host Processor Requirements: Microprocessor to run WLAN TCP/IP stack
  • Hardware Interfaces: SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®)
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, CE
  • Continue reading about the TiWi5 Bluetooth + Wi-Fi WLAN 802.11 a/b/g/n Module
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2.4/5.4 GHz Ceramic Dual B and Chip Antenna 2450AD46A5400E

45 Series

Complete Enterprise 802.11a/b/g/n Wi-Fi and Bluetooth v4.0 dual-mode solution

45 Series 802.11abgn and 802.11abgn + Bluetooth
  • Technology: The Wi-Fi module uses Qualcomm Atheros AR6003 - supports IEEE 802.11a/b/g/n and the Bluetooth module uses the CSR8510 Bluetooth chip
  • Bluetooth Interface: CSR CSR8510 Bluetooth 4.0 dual-mode (EDR+BLE)
  • Chip Set: Atmel 400 MHz ARM 9, P/N AT91SAM9G25-CU
  • Certifications: FCC, IC, CE
  • Continue reading about the 45 Series on Lairdtech.com

50 Series

Dual-Band 802.11n + BT4.0

50 Series Dual-Band 802.11n + BT4.0
  • Technology: 802.11r + CCKM support for rapid roaming and true TX/RX Diversity with 2x2 MIMO
  • Bluetooth Version: Bluetooth v2.1 with EDR, Bluetooth 4.0 (Bluetooth Low Energy)
  • Chip Set: Wi-Fi: Qualcomm Atheros QCA6004. Bluetooth: Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08
  • Certifications: FCC, IC, ETSI, Giteki, RCM
  • Continue reading about the 50 Series on Lairdtech.com

Zigbee/ISM Modules

ProFLEX01-R2

2.4 GHz Integrated RF Module for ZigBee / 802.15.4

ProFLEX01-R2 2.4GHz 802.15.4 Zigbee Module front

Datasheet

Product Brief

  • Size: 0.9 in x 1.63 in x in
  • Standards Support: IEEE 802.15.4, ZigBee®, 6LoWPAN, SimpliciTI, FLEXConnect™
  • Host Interface: UART
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC, CE
  • Continue reading about the ProFLEX01-R2: ZigBee (802.15.4) RF Module

ProFLEX01-SOC

2.4 GHz Integrated RF Module for ZigBee / 802.15.4

ProFLEX-SOC 2.4GHz 802.15.4 RF Module front

Datasheet

SiFLEX02-R2

900 MHz 802.15.4/ZigBee/6LoWPAN RF Module

SiFLEX02-R2 900 MHz 802.15.4 Zigbee Module front

Datasheet

Product Brief

  • Size: 0.9 in x 1.63 in x in
  • Standards Support: IEEE 802.15.4, ZigBee®, 6LoWPAN, FLEXConnect™
  • Host Interface: UART
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC
  • Continue reading about the SiFLEX02: 900 Mhz RF Module

SiFLEX02-R2-HP

High Performance 900 MHz 802.15.4/ZigBee/6LoWPAN RF Module

SiFLEX02-R2-HP 2.4GHz 802.15.4 Zigbee Module front

Datasheet

  • Size: 0.9 in x 1.63 in x in
  • Standards Support: IEEE 802.15.4, ZigBee®, 6LoWPAN, FLEXConnect™
  • Host Interface: UART
  • Industrial Temp Range: -40 to +85 °C
  • Certifications: FCC, IC
  • Continue reading about the SIFLEX02-HP High Performance 900 MHz 802.15.4 Module

RM1xx LoRa Modules

LoRa + Bluetooth Smart v4.0 Integrated Solution for LPWAN EIoT

LoRa + Bluetooth Smart v4.0 Integrated Solution for LPWAN EIoT
  • Size: 25.4 mm x 25.4 mm x 3.15 mm
  • Wireless Specification: LoRa MAC Class A Specification + V4.0 –Bluetooth Smart– Central mode
  • Hardware Interfaces: UART, GPIO, ADC, PWM FREQ output, TIMERS, I2C, and SPI interfaces
  • Software: Laird's powerful, event-driven smartBASIC language for rapid design and deployment
  • RM1xx Modules: Aggregate and transmit data from Bluetooth® Smart (BLE) devices and sensors over LoRa® to gateways as far as 15 km (~10 miles) away
  • Certifications:
  • Pending Certifications: FCC, CE
  • Continue reading about the RM1xx LoRa Modules on Lairdtech.com

RM024 Series

2.4 GHz ISM-Band Multipoint Wireless Modules

2.4 GHz ISM-Band Multipoint Wireless Modules
  • Size: 24.4 mm x 39 mm x 3.6 mm
  • Technology: Built on the core technology and RF expertise of Laird's seven generations of Frequency Hopping Spread Spectrum (FHSS) devices
  • Range: 2.5 mile (4km)
  • RF Data Rate: 280 kbps or 500 kbps selectable
  • Form Factor: SMD-ANT+U.FL, Pluggable-ANT+U.FL, SMD-U.FL, Pluggable-U.FL
  • Certifications:
  • Pending Certifications: FCC, IC, CE
  • Continue reading about the RM024 Series on Lairdtech.com