WiFi Modules | TiWi-SL
Description
TiWi-SL is the industry's first industrial temp-rated Wi-Fi module designed for simple connectivity to the industry's most popular microcontroller platforms. It utilizes Texas Instruments' CC3000 SimpleLink™ technology to move nearly all the functions required for Wi-Fi off the host processor and onto the module.
Features
- Self-contained solution with Wi-Fi driver, security supplicant and TCP/IP stack all on-module
- Small host footprint -- as low as 6KB Flash, 3KB RAM
- Low memory footprint enables Wi-Fi connectivity with MCUs
- Low MIPS/CPU overhead
- Extremely simple API, primarily BSD socket; about 35 total APIs
- Universal IP connectivity enables Wi-Fi anywhere
- Quick Wi-Fi implementation without previous Wi-Fi or RF experience
- Quickly portable to any low-cost, low-power MCU platform
- Enables headless Wi-Fi with TI patented "First Time Config"
- Begin development with any MCU using LSR's TiWi-SL EM Board (450-0089) or with TI's MSP430 FRAM kit
Specifications
- Vcc min (v): 2.9
- Vcc max (v): 3.6
- Transmit power (dBm) (11 Mbps CCK (b)): +19
- Transmit power (dBm) (54 Mbps OFDM (g)): +15
- Receiver sensitivity (dBm) (8% PER, 11 Mbps): -85
- Receiver sensitivity (dBm) (10% PER, 54 Mbps): -70
- Wireless Security: WEP, WPA Personal, WPA2 Personal
- HW Interface: SPI
- Certification and Testing: FCC (USA), IC (Canada), and ETSI (Europe)
- RoHS Compliance: Yes
- Operating Temperature (C): -40 to 85
- Module Size (mm): 14 x 21 x 2.3
Documentation
Ordering Information
| Part Number |
ECCN |
Description |
| 450-0067 |
5A992 |
TiWi-SL Module |
| 450-0089 |
5A992 |
TiWi-SL EM Board with Chip Antenna |
Distribution
